[Inductor Types] Comparison and Selection Guide for Mainstream Market Inductors

Power Inductors

Power inductors are designed for high-current applications, primarily used for energy storage and filtering in power conversion circuits. Power inductors feature low DCR, high saturation current, and good thermal performance. Based on structure and application, power inductors can be classified as:

1. Shielded Power Inductors: Completely encapsulate the coil with magnetic material, featuring low EMI characteristics, suitable for applications sensitive to electromagnetic interference.

2. Unshielded Power Inductors: Have incomplete magnetic circuits, lower cost, but higher EMI, suitable for applications not sensitive to electromagnetic interference.

3. Molded Power Inductors: Use injection or compression molding to integrate the coil and magnetic core, featuring robust structure and vibration resistance, commonly used in automotive electronics.

4. Flat Wire Inductors: Use flat conductors instead of round wire, reducing DCR and increasing current carrying capacity, suitable for high-current, low-loss applications.

Power inductor specifications typically include inductance value (μH), rated current (A), saturation current (A), and DCR (mΩ) as the main parameters.

Classification of Chip Inductors, Wound Inductors, and Power Inductors

Inductors, as key components in electronic circuits, can be classified into various types based on structure, manufacturing process, and application scenarios. Understanding the characteristics of each type is crucial for engineers to select appropriate components.

Chip Inductors

Chip inductors are products of Surface Mount Technology (SMT), featuring small size, light weight, and good compatibility with automated assembly. Based on internal structure and manufacturing process, chip inductors can be classified as:

1. Multilayer Chip Inductors (MLCI): Manufactured using a process similar to multilayer ceramic capacitors, where conductor patterns are printed on ceramic substrates, then stacked and sintered. These inductors feature small size and good consistency, but relatively limited inductance values and current carrying capacity, typically used in high-frequency small-signal applications.

2. Wire-wound Chip Inductors: Copper wire wound around ceramic or ferrite cores, then packaged in SMD form. Compared to multilayer chip inductors, they have higher Q values and wider inductance ranges, but relatively larger size.

3. Thin-film Chip Inductors: Manufactured using thin-film deposition and photolithography techniques, mainly applied in high-frequency RF circuits, featuring precise inductance values and excellent high-frequency characteristics.

Chip inductor package specifications typically follow EIA standards, such as 0201, 0402, 0603, 0805, 1008, 1210, etc., with numbers representing length and width in inches (e.g., 0402 means 0.04 inches × 0.02 inches).

Wound Inductors

Wound inductors are the most traditional type of inductors, formed by winding wire around a magnetic core. Based on core shape and winding method, wound inductors can be further classified:

1. Toroidal Inductors: Wire wound around a ring-shaped core, featuring self-contained magnetic field, low leakage, and low EMI, commonly used in high-performance power supplies and audio equipment.

2. Solenoid Inductors: Wire wound around a rod-shaped core, simple structure, low cost, but higher leakage and more prominent EMI issues.

3. Pot Core Inductors: Wire wound around a center post, with magnetic material forming a closed magnetic circuit externally, featuring good shielding effect and high Q value, commonly used in precision filter circuits.

4. Drum Core Inductors: Wire wound around a drum-shaped core, with structure between toroidal and solenoid types, balancing performance and cost.

Wound inductors typically provide higher inductance values and greater current carrying capacity, but are larger in size and have lower efficiency in automated production.

Application Characteristics Comparison

Inductor Packaging Forms and Installation Considerations

The packaging form of inductors directly affects their installation method, thermal performance, and reliability. Understanding the characteristics of different packages and installation considerations is crucial for PCB design.

Common Inductor Packaging Forms

1. SMD Packaging:

• Standard Chip Packages: 0201, 0402, 0603, 0805, 1008, 1210, etc., numbers represent dimensions in inches

• Power Inductor Packages: 2x2mm, 3x3mm, 4x4mm, 5x5mm, 6x6mm, 7x7mm, 10x10mm, etc., representing length and width dimensions

• Special Shape Packages: Such as low-profile (LP), ultra-thin (UT), etc., suitable for space-constrained applications

2. THT Packaging:

• Axial Leads: Leads extending from both ends of the inductor body, suitable for small inductors

• Radial Leads: Leads extending from the bottom of the inductor body, suitable for medium-sized inductors

• Vertical Mounting: Inductor mounted perpendicular to the PCB, saving PCB area

• Horizontal Mounting: Inductor mounted parallel to the PCB, reducing overall height

3. Special Packaging:

• Adjustable Inductor Packaging: With adjustment mechanism for fine-tuning inductance value

• High-Power Packaging: With heat dissipation structures, suitable for high-current applications

• Combination Packaging: Multiple inductors integrated in one package, such as common-mode inductors

Structural Features and Performance Parameter Comparison of Various Inductors

Understanding the structural features and performance parameter comparison of different inductors helps engineers select the most suitable inductor type based on application requirements.

Structural Features Comparison

Performance Parameter Comparison

EMI Suppression Applications

For power input/output terminals, signal lines, and other scenarios requiring electromagnetic interference suppression, inductors are used to form EMI filters. Inductor selection strategy for such applications:

• Priority Consideration: Common-mode inductors, ferrite beads, toroidal inductors

• Key Parameters: Impedance-frequency characteristics, saturation characteristics

• Typical Specifications: Selected based on suppression frequency band and current requirements

• Considerations:

• Analyze the spectral characteristics of noise to be suppressed

• Distinguish between common-mode and differential-mode interference, select appropriate inductors

• Consider the impact of large current pulses on inductor saturation

• Evaluate the effect of temperature on suppression performance

Portable Device Applications

In smartphones, tablets, and other portable devices, inductors need to meet miniaturization and low power consumption requirements. Inductor selection strategy for such applications:

• Priority Consideration: Small shielded power inductors, integrated inductors

• Key Parameters: High power density, low profile height, low DCR

• Typical Specifications: 0.47μH4.7μH, 2x2mm3x3mm packages

• Considerations:

• Balance size and performance requirements

• Consider inductor thermal issues

• Evaluate the EMI impact on sensitive circuits

• Consider efficiency requirements under battery-powered conditions

Inductor Selection Strategies for Different Application Scenarios

Inductor selection needs to be comprehensively considered based on specific application scenario requirements. Below are inductor selection strategies for several typical application scenarios:

High-Frequency RF Applications

In RF circuits, wireless communication modules, and other high-frequency applications, inductors are mainly used for matching networks, oscillator circuits, and filters. Inductor selection strategy for such applications:

• Priority Consideration: Multilayer chip inductors, air-core wound inductors

• Key Parameters: High Q value, high self-resonant frequency (SRF), low parasitic capacitance

• Typical Specifications: 1nH~100nH, 0201/0402 packages

• Considerations:

• Avoid using ferrite core inductors, which have high losses at high frequencies

• Consider inductor temperature stability to ensure frequency stability

• Pay attention to coupling and shielding issues between inductors

Switching Power Supply Applications

In DC-DC converters, Buck/Boost circuits, and other power supply applications, inductors are mainly used for energy storage and conversion. Inductor selection strategy for such applications:

• Priority Consideration: Shielded/unshielded power inductors, toroidal inductors

• Key Parameters: Saturation current, DCR, temperature rise characteristics

• Typical Specifications: 1μH~100μH, rated current determined based on power requirements

• Considerations:

• Ensure operating current is below 80% of saturation current

• Calculate inductor losses and evaluate heat dissipation requirements

• Consider inductor EMI impact, select shielded type if necessary

• Evaluate inductor performance changes across the full temperature range

Signal Filtering Applications

In analog signal processing, audio circuits, and other filtering applications, inductors combine with capacitors to form LC filters. Inductor selection strategy for such applications:

• Priority Consideration: Wire-wound chip inductors, pot core inductors

• Key Parameters: Precise inductance value, high Q value, low distortion

• Typical Specifications: 10μH~10mH, accuracy ±5% or higher

• Considerations:

• Select inductors with good linearity and low distortion

• Consider temperature stability of inductance value

• Pay attention to inductor shielding to avoid picking up external interference

• Evaluate inductor impedance characteristics within the operating frequency range

Conclusion

As key components in electronic systems, inductors come in various types with different performance characteristics. When selecting inductors, engineers need to comprehensively consider application requirements, circuit characteristics, installation conditions, and other factors, avoiding common pitfalls to select the most suitable inductor.

As electronic products evolve toward miniaturization, high efficiency, and high reliability, inductor technology continues to innovate. New magnetic materials, advanced manufacturing processes, and innovative structural designs continue to emerge, providing engineers with more choices. Mastering the basic principles and methods of inductor selection is crucial for designing high-performance electronic systems.

In practical applications, it is recommended that engineers maintain good communication with inductor suppliers, fully utilize their application engineering resources, and conduct thorough testing and verification in the prototype stage to ensure the rationality of inductor selection and system reliability.

Installation Considerations

1. PCB Layout Design:

• Inductors should be placed away from heat-sensitive and magnetically sensitive components

• PCB under power inductors should be designed with thermal copper areas

• Multiple inductors should consider magnetic coupling issues, avoiding parallel arrangement

• Sufficient cooling space should be reserved around inductors

2. Soldering Process:

• SMD inductors typically use reflow soldering

• Large power inductors may require wave soldering or manual soldering

• Pay attention to controlling soldering temperature and time to avoid damaging the magnetic core

• Some inductors are heat-sensitive and soldering thermal stress should be considered

3. Mechanical Reliability:

• Consider inductor stability in vibration environments

• Large inductors may require additional mechanical fixation

• Evaluate the impact of thermal cycling on solder joint reliability

• Consider the stress on PCB from inductor self-weight

4. Thermal Design:

• High-current inductors need to consider thermal channel design

• PCB copper foil thickness and area significantly affect heat dissipation

• Add cooling holes or heat sinks when necessary

• Evaluate thermal coupling effects of multiple heat-generating components

5. EMI Considerations:

• Additional shielding measures may be needed around unshielded inductors

• Sensitive signal lines should be kept away from power inductors

• Consider the impact of inductor magnetic fields on surrounding components

• Add ground shielding layers on PCB when necessary